Abstract
Recently high quality factor and small-occupying-area inductors are prerequisite for wireless communication products such as mobile phones and wireless network, low cost and high performance on chip radio-frequency devices and microwave integrated circuit applications. In high frequencies, non-uniform current density distribution in the edge of the coil due to skin effect and proximity effect increases effective resistance of inductor and reduces the quality factor. This paper presented a multipath circular spiral inductor. The multipath technique reduces the skin and proximity effects, therefore increases the quality factor of the inductors. Simulation has been taken using COMSOL Multiphysics software. The results show maximum quality factor of proposed inductor have been achieved about 79 at 230 MHz that have been improved around 73% compared with conventional one. The dimension of the inductor is 2300 µm × 2300 µm. The small size proposed structure with high Q-factor is sufficient for the wireless applications.
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