Abstract
In this paper, the effect of 0.1 wt.% Cr addition into Sn–9Zn lead-free solder alloys on the growth of intermetallic compound (IMC) with Cu substrate during soldering and subsequent isothermal aging was investigated. During soldering, it was found that 0.1 wt.% Cr addition did not contribute to forming the IMC, which was verified as the same phase structure as the IMC for Sn–9Zn/Cu. However, during solid-state isothermal aging, the IMC growth was remarkably depressed by 0.1 wt.% Cr addition in the Sn–9Zn solder, and this effect tended to be more prominent at higher aging temperature. The activation energy for IMC growth was determined as 21.2 kJ mol − 1 and 42.9 kJ mol − 1 for Sn–9Zn/Cu and Sn–9Zn–Cr/Cu, respectively. The reduced diffusion coefficient was confirmed for the 0.1Cr-containing solder/Cu. Energy-dispersive X-ray mapping and point analysis also showed ZnCr phase existing in solder matrix, which can reduce diffusion rate of Zn atoms.
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