Deposition rate and morphology of electroless copper film from solutions containing 2,2′-dipyridyl

Abstract

Crystal structure and surface morphology of electroless copper films deposited from solutions containing 2,2′-dipyridyl were investigated by X-ray diffraction and electron microscopic observations. The deposition rate of copper was remarkably affected by bath temperature and 2,2′-dipyridyl concentration. Although Cu 2O was codeposited in the copper film prepared at 30 °C, pure metallic copper was obtained at 70 °C regardless of dissolved O 2. The surface morphology of the copper deposit plated at 30 °C exhibited a fine grain structure, while a coarse grain structure was observed for the copper deposit plated at 70 °C. Changes in crystal structure and surface morphology of the copper films are discussed as a function of deposition rate.