Deposition of nanocomposite carbon-based thin films doped with copper and fluorine

Abstract

This paper is focused on plasma-enhanced chemical vapor deposition (PECVD) of novel carbon-based thin films. Unique thin films were deposited from a mixture of methane, hydrogen, and a precursor containing fluorine and copper: (hfac)copperVTMS (hfac = hexafluoroacetylacetonato and VTMS = vinyltrimethylsilane). Using the (hfac)copperVTMS precursor in PECVD deposition results in the advantageous chemical composition of carbon-based thin films while maintaining sufficient mechanical properties. Furthermore, with optimized plasma parameters, the films deposited on the substrate exhibit a nanocomposite structure. This nanostructured surface can increase the surface area, which is beneficial for various applications, including antibacterial and antiviral properties. The radiofrequency glow discharge at low pressure (≈70Pa) and power P=25W and P=250W was used for deposition. Deposited thin films were analyzed using X-ray photoelectron spectroscopy, water contact angle measurement, atomic force microscopy, and nanoindentation techniques. Despite the doping of carbon-based thin films with soft copper, the prepared films exhibited sufficient mechanical properties, which are crucial for the future implementation of this deposition process.