Deposition and thermal processing of ferroelectric thin films with the primaxx 2f platform

Abstract

The Primaxx 2F platform is designed specifically for production level deposition and thermal processing of ferroelectric thin films using MOD chemistry. This platform provides precleaning, deposition, and thermal processing within one integrated product. Wafers are precleaned (O3/O2) in the Rapid Thermal Processing (RTP) module, deposited with the ferroelectric thin film in the Liquid Source Misted Chemical Deposition (LSMCD) module, soft baked in the Low Temperature Processing (LTP) module, and rapid thermal annealed in the Rapid Thermal Processing (RTP) module. The Primaxx 2F platform deposits Strontium Bismuth Tantalate (SBT) films (70–120 nm) with deposition uniformity and repeatability less than 3%. SBT films deposited using a 700°C process in the 2F platform yield 2Pr greater than 14 uC/cm2 at 3V and leakage currents less than 10−6 Amp/cm2 at 3 V. Films of SBT processed through this platform exhibit a smoother surface morphology and have higher device yields (lower defect density) over SBT films deposited by conventional spin-on.