Deployment dynamics of thick panel Miura-origami

Abstract

Origami and kirigami folding methods applied to deployable structures have been investigated in many studies, and most of them use approximately zero-thickness materials to follow the paper-folding movement. However, the rigidity and thickness of materials cannot be neglected in aerospace engineering applications, resulting in different kinematic and dynamic characteristics of deployment. This work deals with the deployment dynamics of a typical thick panel Miura origami (Miura-ori). The kinematics of the Miura-ori unit and array are discussed considering the tessellated extension of the Miura-ori pattern, which can be described by the recursively relative movement. Based on the Lagrange's equation, the dynamic equation is determined by generalized force and potential energy. Furthermore, prototypes for Miura-ori unit and array are fabricated, respectively. To measure the dynamic behaviours during deployment, a gravity compensation apparatus is designed and constructed, which can effectively reduce the gravity effect of Miura-ori prototypes. The comparison of the numerical and experimental results validates our dynamic model. Our work provides a recursive dynamic modelling method and experiment apparatus for analysing and testing the deploying dynamic behaviours of tessellated thick-panel origami deployable structures, and the findings can be developed in the other thick-panel origami and kirigami concepts of actual engineering applications in the future.