Abstract

When changing surface wettability and nanostructure size, condensation behavior displays distinct features. In this work, we investigated evaporation on a flat hydrophilic surface and condensation on both hydrophilic and hydrophobic nanostructured surfaces at the nanoscale using molecular dynamics simulations. The simulation results on hydrophilic surfaces indicated that larger groove widths and heights produced more liquid argon atoms, a quicker temperature response, and slower potential energy decline. These three characteristics closely relate to condensation areas or rates, which are determined by groove width and height. For condensation heat transfer, when the groove width was small, the change of groove height had little effect, while change of groove height caused a significant variation in the heat flux with a large groove width. When the cold wall was hydrophobic, the groove height became a significant impact factor, which caused no vapor atoms to condense in the groove with a larger height. The potential energy decreased with the increase of the groove height, which demonstrates a completely opposing trend when compared with hydrophilic surfaces.

Highlights

  • Both evaporation and condensation are common phase-change phenomena in daily life [1]

  • Evaporation and condensation phenomena at the micronano scale have a large number of applications in many aspects, and have become a widespread concern

  • Studying the heat transfer mechanism at the nanometer scale can help with the rapid miniaturization of electronic equipment

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Summary

Introduction

Both evaporation and condensation are common phase-change phenomena in daily life [1]. They are extensively used in various industrial fields, such as thermal management [2,3,4,5,6], heat pipes [7,8,9], cooling water harvesting [10,11,12], and electrical devices [13,14]. Evaporation and condensation phenomena at the micronano scale have a large number of applications in many aspects, and have become a widespread concern. Studying the heat transfer mechanism at the nanometer scale can help with the rapid miniaturization of electronic equipment

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