Dependence of thermal residual stress on temperature in a SiC particle-reinforced 6061Al alloy

Abstract

The thermal stresses (TS) in the matrix of a SiCp/6061Al composite during thermal cycling were measured by X-ray diffraction. Also, the TS during thermal cycling and residual stress distribution (RSD) at room temperature in the two phases of composite were calculated by finite element modeling (FEM). The measured and calculated results indicated that the closed stress-temperature loop was formed during thermal cycling. The stress state in the matrix changed from tension to compression during heating and from compression to tension during cooling. Plastic deformation took place in the matrix of the composite during thermal cycling. The general change trend of TS with temperature during thermal cycling was in agreement between the experiment and calculation.