Abstract

We have performed negative and positive bias temperature instability (NBTI and PBTI) measurements on devices having different gate oxide types and thicknesses. The devices used for the study include 130nm and 90 nm oxynitrided gate dielectric bulk Si technology and devices with pure SiO2 gate dielectric. NBTI and PBTI were studied for both p-channel and n-channel MOSFETs for each of the oxide types and thicknesses, this requires the measurements be made in both accumulation and inversion modes. Using “Pseudo DC” measurements at 120 oC on p-channel and n-channel devices, we have extracted at least three distinct components of BTI. We find evidence for the existence of positive charge injection for PMOS under PBTI and more puzzling results for NMOS under PBTI, where unexpected interface state creation was observed.

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