Abstract
Detailed analysis of electromigration damage, voids and hillocks, formed in layered conductors of aluminum over tungsten, revealed the following: (i) The number densities (numbers of voids and hillocks formed per unit conductor length) by electromigration are proportional to the current density; (ii) even when the void number density changes, the average growth rate of each void is still proportional to the current density; (iii) the positions of all the voids are uniformly distributed on a line; however, there is a regularity in intervals between one void to the next void and one void to the next hillock. From these results, especially from (i) and (ii), it is suggested that the dependence of void number density on the current density contributes to the higher than expected dependence of electromigration lifetime on the current density.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
