Abstract
This paper considers the dependence of critical current density on microstructure in Ag sheathed Ba 2YCu 3O 6+x tapes. The critical current density increased with decreasing tape thickness when the Ag sheathed tapes were prepared by either pressing or cold rolling techniques. The improvement in critical current density was attributed to structural refinements such as textured grain structure and high increase in density. Pressing was found to be a more effective technique than cold rolling. The dependence of critical current density on tape thickness has been tentatively explained in terms of either surface pinning or grain boundary pinning.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
