Abstract

Recently, we have investigated the frequency dependence of the drain conductance Gd of high-electron-mobility transistors (HEMTs) employing an InAlAs/InGaAs material system that is lattice-matched to an InP substrate in detail and showed that, on the basis of theoretical considerations, it is due to the accumulation of holes in the source region and their recombination with two-dimensional electron gas (2DEG) in the source region. To better understand this carrier recombination model, we have investigated in detail the dependence of the carrier lifetime τ on the gate-to-source voltage VGS and on the effective drain-to-gate voltage VDG,eff applied to the side of the gate-to-drain path. Experimental results for the VGS dependence of the carrier lifetime τ not only confirm that the recombination of holes accumulating in the source region with 2DEG is dominated by Auger recombination but also show that the gradients of τ become less steep at a VGS larger than 0.4 V. A theoretical study of this phenomenon revealed that excess electrons penetrate in the δ-doped layer with increasing VGS and are captured by the ionized donors distributed δ-doped layer. As a result, the electrical field in the δ-doped layer decreases with increasing VGS and then the surface potential drops.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.