Abstract
The coating of Cu on Fe-Cr-Ni austenitic stainless steel is useful in electrical and electronic fields where both high conductivity and high strength are required. It was found that ionized vapour deposition under electron bombardment was effective in obtaining a tight Cu coating film on Fe-Cr-Ni stainless steel. The adhesion of the Cu film made by this new method was estimated to be at least 100 times higher than by conventional vapour deposition. Electron spectroscopy for chemical analysis revealed that Cu bonding with oxygen was in the form of CuO at the interface. The thickness of this copper oxide layer at the interface was about 30 nm. The increased adhesion was due to the change from physical adsorption to chemical adsorption, such as CuO.
Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
