Abstract
W-Cu-W sandwich coatings are prepared by d.c. magnetron sputtering and the film density is evaluated by RBS and scanning electron spectroscopy measurements. In order to improve the film density up to the bulk density and obtain a dense metallic coating, it is necessary and effective to optimize the deposition parameters, such as, increasing target power and decreasing Ar working pressure. The reduction of the film density from its bulk density is induced by microstructure change and incorporated impurity gas, such as oxygen and argon. When film density is increased, oxygen contamination, due to wall desorption or sample storage in air, decreases.
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