Abstract
The surface tension and density of the ternary Bi–Cu–Sn alloys have been measured by the sessile-drop method. Measurements were carried out for three cross sections with the constant bismuth-to-copper ratios of 2:1, 1:1, and 1:2. The density of all the investigated alloys decreases with rising temperature. A decrease of the surface tension is also observed when the temperature increases, except at two compositions on the copper-rich side. An increase of copper content could slightly decrease the density in the Bi–Cu–Sn system and significantly increase the surface tension as well. Experimental values of the surface tension were also compared with those calculated from Butler’s equation.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
