Dense Intra-Cavity Interconnection Technology for Hermetically Packaged MMICs

Abstract

Northrop Grumman Space Technology has recently developed a technology that is capable of creating dense intra- cavity interconnections (ICICs) for hermetically packaged MMICs. These interconnections provide signal routing between circuits residing on the facing surfaces within the sealed wafer level package. They are fabricated by batch processes and are fully compatible with NGST's MMIC production processes. Greater than 90% interconnection yield is consistently obtained from different substrate material combinations. RF ICIC transitions with insertion loss of less than 0.1dB at 15GHz have been demonstrated. These ICICs are also proven to be mechanically and thermally robust. NGST's dense ICIC technology enables heterogeneous integration of multi-functional MMICs and MMIC modules.