Abstract
In this paper, dense, highly elastic compressible microinterconnects (CMIs) are presented as an enabling technology for next generation sockets, probe cards and heterogeneous integrated systems. Free-standing CMIs with 75 µm height are fabricated using a thick sacrificial photoresist layer with an upward curved sidewall profile. The CMIs show a 45 µm vertical elastic range of motion. The fabricated CMIs have an in-line pitch of 150 µm, mechanical compliance of 9.2 mm/N, and vertical elastic motion of up to 5,000 indentation cycles. The smallest in-line pitch of CMIs demonstrated is 40 µm. The average post-assembly resistance of the CMIs, including the contact resistance, was measured to be 176.3 mΩ.
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