Demonstration of RF and Microwave Passive Circuits Through 3-D Printing and Selective Metalization

Abstract

The ultimate goal of this paper is to print radio frequency (RF) and microwave structures using a 3-D platform and to pattern metal films on nonplanar structures. To overcome substrate losses, air core substrates that can readily be printed are utilized. To meet the challenge of patterning conductive layers on complex or nonplanar printed structures, two novel self-aligning patterning processes are demonstrated. One is a simple damascene-like process, and the other is a lift-off process using a 3-D printed lift-off mask layer. A range of microwave and RF circuits are designed and demonstrated between 1 and 8 GHz utilizing these processes. Designs are created and simulated using Keysight Advanced Design System and ANSYS High Frequency Structure Simulator. Circuit designs include a simple microstrip transmission line (T-line), coupled-line bandpass filter, circular ring resonator, T-line resonator, resonant cavity structure, and patch antenna. A commercially available 3-D printer and metal sputtering system are used to realize the designs. Both simulated and measured results of these structures are presented.