Abstract
We demonstrate imaging interferometric microscopy (IIM) for binary objects in two dimensions. Combining multiple exposures with different off-axis illumination configurations together with interferometric restoration of the zero-order beam during dark-field conditions, IIM provides high lateral resolution at low numerical apertures (NA). It retains the large field-of-view, long working distance and large depth-of-field of a low-NA imaging system. Also we include a first demonstration of imaging of a phase mask. All these properties are increasingly important for in semiconductor mask metrology. IIM relies on image processing to reconstruct the image; we present the processes necessary to obtain the combined image. Finally we compare the experiment with a simple Fourier optics model.
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