Delamination buckling of a thin film bonded to an orthotropic substrate

Abstract

This paper investigates the delamination buckling of an orthotropic film with compressive prestress bonded to an orthotropic substrate. The buckled film detached from the film/substrate structure is solved in the closed form except for the resultant force and bending moment at the ends of the buckled film, which are obtained by matching the solutions for the buckled film and the film/substrate structure in which the buckled part of the film is removed. Special attention is paid to the effects of parameters of orthotropic materials on delamination buckling based on a numerical analysis. The energy release rate and mode mixity induced by buckling are evaluated, and the growth and arrest of the interface crack under mixed loading induced by buckling are discussed based on the energy criterion.