Degree of cure of epoxy/acrylic photopolymers: Characterization with raman spectroscopy and a modified phenomenological model

Abstract

This study characterizes the degree of cure c, of a two‐part epoxy/acrylic photopolymer used in stereolithography, SLA. The use of solid free form fabrication has added a whole new list of thermosets with a chemical reaction—curing reaction—targeted for these specific manufacturing processes. The studied thermosetting system exhibits a fast curing reaction triggered by a UV‐light source. An innovative stepwise method to quantify the degree of cure using Raman spectroscopy is reported. This method abates the Raman noise and compensates for the weak signal of fast measurements. The Raman data processing algorithm BEADS was implemented. The technique presented here was capable of following the degree of cure of the individual components of the photopolymer. Based on the epoxy/acrylic monomers concentration (75%/25%), the degree of cure for the whole system was quantified. The experimental results were modeled using a modified phenomenological kinetics equation. This model includes the dependency of the rate of cure on the light intensity, and cure state. Based on the analysis reported here, the proposed model accurately fits the initiation, propagation, and termination phases of the cure cycle. The technique and methods presented here can potentially be integrated to in situ process monitoring with instant parameter feedback, and numerical modeling of residual stresses in additive manufacturing of thermosets. POLYM. ENG. SCI., 58:228–237, 2018. © 2017 Society of Plastics Engineers