Degradation of the Strength of Grains and Grain Boundaries of Ni-Base Superalloy under Creep and Creep-Fatigue Loadings

Abstract

The degradation process of the micro texture of Ni-base superalloys was observed under fatigue and creep-fatigue loading conditions at elevated temperatures higher than 700oC by applying electron back-scatter diffraction (EBSD) analyses. The local distribution of the crystallinity of a grain and a grain boundary was defined quantitatively by analyzing the Kikuchi pattern obtained from each electron-beam-irradiated area with a diameter of 50 nm. The calculated image quality value was used for the analysis. It was found that the crystallinity of grain boundaries degraded seriously under creep-fatigue loading conditions due to the acceleration of anisotropic strain-induced diffusion of component elements. Since the initial finely-controlled strengthened micro texture disappeared due to the anisotropic diffusion of component elements, this degradation was found to cause the drastic decrease of the strength of grains and grain boundaries and thus, lifetime of the material. The decrease of the strength of both grains and grain boundaries was measured by micro tensile test system in a scanning electron microscope by making a small sample from bulk specimen using focused ion beam. The strength of a grain and a grain boundary varied drastically depending on their crystallinity, in other words, the image quality value.