Abstract
This paper is mainly reported to a pulse reliability investigation of high power single emitter laser modules with nanosilver paste. Comparative experiments in continuous pulse conditions for the laser modules packaged with nanosilver paste, indium and AuSn solders were conducted. The results indicate that the laser modules attached by nanosilver paste have a longer-term lifetime than those with indium and AuSn solders in continuous pulse conditions. Transient thermal behavior and coupled thermo-mechanical behavior in continuous pulse conditions are simulated by finite element method (FEM). A semi-empirical model based on Arrhenius relationship is established to provide relative reliability assessments for laser modules by combining with the simulating results.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callSimilar Papers
More From: Microelectronics Reliability
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
