Abstract
The grain-size effect on deformation twinning in nanocrystalline copper is studied. It has been reported that deformation twinning in coarse-grained copper occurs only under high strain rate and/or low-temperature conditions. Furthermore, reducing grain sizes has been shown to suppress deformation twinning. Here, we show that twinning becomes a major deformation mechanism in nanocrystalline copper during high-pressure torsion under a very slow strain rate and at room temperature. High-resolution transmission electron microscopy investigation of the twinning morphology suggests that many twins and stacking faults in nanocrystalline copper were formed through partial dislocation emissions from grain boundaries. This mechanism differs from the pole mechanism operating in coarse-grained copper.
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