Abstract
Bulk nanocrystalline Cu was synthesized by a pulse electric brush-plating technique. A very large strength (at 2% plastic strain) increase from 644 to 1451 MPa was obtained by compression tests at room temperature and strain rates from 1×10−5 to 3×100 s−1. A transition in plastic deformation mechanism with strain rate from a combination of the thermally activated grain boundary sliding and the dislocation emission-absorption in grain boundaries to one dominated by the dislocation activity has been revealed by the significant changes in strain rate sensitivity and apparent activation volume with strain rate.
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