Abstract
Our objective is to develop an effective method for measuring deformation in small solder ball joints. We focused on the Zeebeck Effect, which is characterized by electromotive force (Emf) in thermo-coupling and tried to measure Emf when the solder ball was deformed. A Cu wire-Solder ball-Cu/Ni wire arrangement was made. Usually a thermocouple connection for temperature measurement has two different metal wires directly facing each other. But, for our experiments a third metal, i.e., solder, was sandwiched between the two-thermocouple wires. The diameter of the solder ball was 1.3 mm. When an Emf was generated and measured at various deformation speeds of the solder ball, we found that the Emf increased as the deformation increased. Furthermore, the Emf changed in relation to the load cycling magnitude. We demonstrated that the proposed Emf measuring method can be a useful and powerful tool for the deformation evaluation of real solder connections.
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