Deformation behavior of dilute SnBi(0.5 to 6 at. pct) solid solutions

Abstract

Tensile and creep tests were conducted to characterize the deformation behavior of four dilute SnBi alloys: SnBi0.5 at. pct, SnBi1.5 at. pct, SnBi3 at. pct, and SnBi6 at. pct, the last two being supersaturated solid solutions at room temperature. The test temperatures were − 20 °C, 23 °C, 90 °C, and 150 °C, and the strain rates ranged from approximately 10−8 to 10−1 1/s. In the tensile tests, all the alloys showed strain-hardening behavior up to room temperature. At higher temperatures, only the higher-Bi-content alloys exhibited strain softening. The deformation behavior of the alloys can be divided into two stress regimes, and the change from the low-stress regime to the high-stress regime occurred at around 6 × 10−4<σ/E<7.5 × 10−4. The results suggest that, at the low-stress regime, the rate-controlling deformation mechanism changes from dislocation climb to viscous glide with the increasing Bi content of the alloy. At the high-stress regime, the activation energy of deformation is about equal in all the alloys (∼60 kJ/mol) and the stress exponents are high (10<n<12.5). Unlike in the other alloys, bismuth precipitated at room temperature from the solution-annealed and quenched SnBi6 at. pct alloy by the discontinuous mechanism. This strongly affects the mechanical properties and makes the alloy brittle at lower test temperatures. A comparison of the deformation behavior of the dilute SnBi alloys to that of the eutectic SnBi alloy suggests that the deformation of eutectic structure is controlled by the Sn-rich phase containing the equilibrium amount of dissolved Bi.