Abstract
In this contribution, our progress in development of deformable single-crystalline-silicon electronics by modification of the previously reported ultra-thin and flexible CIRCONFLEX technology is presented. Additional deformability/reliability is achieved by lateral segmentation of silicon/dielectric layers and connecting these using flexible electrical interconnect. In the current study, segment thickness (silicon/SiO2) of ~1 mum, segment size between 150 and 450 mum, spacing of 20-200 mum and serpentine-shaped aluminum interconnect transferred onto 8-10 mum thick polyimide film are characterized by bending and tensile stretching to find out the reliability limits. Compared to our previous reports, next to the processing issues also new electrical integrity results obtained from passive electrical test structures implemented on fully segmented polymer-embedded silicon islands are presented.
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