Abstract
Abstract A new class of interconnects that exhibit resilience to mechanical deformation are demonstrated with flexible fan-out or embedded-die packages. Active device embedding in flexible substrates is accomplished with direct printed interconnects onto die pads. Such a planar fan-out interconnect technology with a low-cost manufacturable process-flow results in the lowest electrical parasitics compared to flipchip with adhesives or printed-ramp interconnections with surface-assembled devices. The interconnects are made with conductive flexible silver-elastomer composites to sustain elastic deformation. The process is also modified to realize flexible backside-assembled fan-out interconnections where the backside of the die is accessible.
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