Abstract

The interface-debonding defects of adhesive bonding structures may cause a reduction in bonding strength, which in turn affects the bonding quality of adhesive bonding samples. Hence, defect recognition in adhesive bonding structures is particularly important. In this study, a terahertz (THz) wave was used to analyze bonded structure samples, and a multi-feature fusion convolutional neural network (CNN) was used to identify the defect waveforms. The pooling method of the squeeze-and-excitation (SE) attention mechanism was optimized, defect feature weights were adaptively assigned, and feature fusion was conducted using automatic label net-works to segment the THz waveforms in the adhesive bonding area with fine granularity waveforms as an input to the multi-channel CNN. The results revealed that the speed of the THz waveform labeling with the automatic labeling network was 10 times higher than that with traditional methods, and the defect-recognition accuracy of the defect-recognition network constructed in this study was up to 99.28%. The F1-score was 99.73%, and the lowest pre-embedded defect recognition error rate of the generalization experiment samples was 0.27%.

Full Text
Published version (Free)

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call