Abstract
For specific modification of the fundamental optical and photoelectrical properties of silicon transparent for wavelengths beyond 1.1μm, boron ions have been implanted into n-type wafers at doses of 1 х 1013 cm-2–1 х 1015 cm-2 followed by annealing at 900 °C and 1000 °C (20 min). The IR reflection spectra, Raman spectroscopy and scanning electron microscopy data have been compared with the photosensitivity spectra (1.4–2.2 μm) and with the integrated photoresponse in the IR (1.0–4.1 μm) and UV (0.25–0.4 μm) regions. These studies allow for materials engineering to obtain new data on the influence of defect formation on the optical properties of the material and to evaluate the technological conditions for practical application of the modified material.
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