Defect and fault tolerant interconnection strategies for WASP devices : Mohammed B. A. Hussaini, Hamid Bolouri and R. Mike Lea. IEEE Transactions on Components, Packaging and Manufacturing Technology, Part B, 18 (3), 416 (August 1995).

Abstract

While WSI-based devices continue to be of particular interest for applications with severe performance, size, weight, power, cost, and reliability requirements [1]-[3], various implementation constraints in the past, including interconnect defect occurrences, have prevented their successful realization. This paper presents an investigation into defect and fault tolerant interconnect strategies for a representative WSI device, WASP (WSI Associative String Processor [3]).