Abstract
The design, synthesis, and evaluation of a new resist formulation tailored for use in the deep UV (254 nm) is described. The resist is based on use of 2,2-dimethyl-4,6-dioxo-5-diazo-1,3-dioxolane (5- diazo-Meldrum's acid) and derivatives thereof as a sensitizer for cresol formaldehyde novolac resin. The new class of sensitizers provides an intense bleachable absorbance at 254 nm and couples sensitivity with plasma etch resistance. The resist exhibits remarkable dissolution kinetics which provide for high resolution imaging devoid of standing wave phenomena. A series of experiments designed to provide understanding of the dissolution kinetics are described.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
