Abstract

AbstractDeep‐level transient spectroscopy (DLTS) has been applied to high‐temperature annealed n‐ and p‐type Si wafers. The aim is to identify the deep levels responsible for the observed minority carrier lifetime degradation after thin‐film transfer to a glass substrate. Anneals have been performed at 1150 °C in H2 or Ar. Care has been taken to avoid radiation defect formation during the fabrication of the Al Schottky barriers used for DLTS. It is shown that besides a change in the carrier doping density and profile, an annealing‐induced electron trap at 0.43 eV below the conduction band edge can be found, which is related to a vacancy–impurity complex.

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.