Abstract
A methodology for obtaining the optimal structure and distribution for the gradient properties of a material in order to reduce the stress level in a soldered joint was constructed. The developed methodology was based on a combination of topological optimization methods (the moving asymptotes method) and the finite elements method; it was first implemented to solve problems of optimizing soldered joints. Using the proposed methodology, a number of problems were solved, allowing one to obtain optimal structural characteristics, in which a decrease in stress is revealed. Designing compounds using this technique will provide more robust designs. The proposed technique can be applied to a wide class of practical problems.
Highlights
Most structures in the aviation, shipbuilding and rocket industries are aimed at achieving a high resistance against various loads while being simultaneously lightweight
A mathematical model is proposed and a methodology was developed for solving a solder class of thermoelastic problems of topological optimization with the aim to obtain the optimal structure and required gradient properties of the solder layer to decrease the level of shear stresses generated in it
The problem of topological optimization for the task of decreasing the peak values of stresses σ12 in the solder layer can be formulated in the following way:
Summary
Most structures in the aviation, shipbuilding and rocket industries are aimed at achieving a high resistance against various loads while being simultaneously lightweight. The work was focused on achieving joints with maximum light in the static conditions by changing the profiles of adhesives It was shown how the optimization of the form causes a significant reduction of stresses in the adhesive layer. Using the finite element method, the characteristics of the stresses and strains distribution in soldered joints under thermal load were analyzed. Despite the complexity of manufacturing topologically optimal connection layers, the structure type optimal for obtaining the maximum bond strength for a specific design is of great interest, since it determines the target solution that must be achieved. A mathematical model is proposed and a methodology was developed for solving a solder class of thermoelastic problems of topological optimization with the aim to obtain the optimal structure and required gradient properties of the solder layer to decrease the level of shear stresses generated in it.
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