Abstract
Hypereutectic Al–Si (20 wt.%) alloy parts were fabricated by employing a powder injection moulding (PIM) technique with a developed multi-component binder system composed of high-density polyethylene (35 wt.%), carnauba wax (62 wt.%) and stearic acid (3 wt.%). The feedstocks contained 83 wt.% metal powders. The debinding process was carried out by a combination of solvent extraction and thermal decomposition. The effects of solvent debinding variables such as kind of solvents, debinding temperatures and time, and the bulk surface area to volume ratios on the debinding process were investigated. Thermal debinding and the subsequent sintering process were carried out in a heating sequence under a nitrogen atmosphere. The influences of sintering temperature and sintering time on the mechanical properties and structure were considered. Under the optimal sintering condition, sintering at 550 °C for 3 h, the final sintering parts were free of distortion and exhibited good mechanical properties. Relative sintered density, Brinell hardness, and tensile strength were ~95.5%, 58 HBW and ~154, respectively.
Highlights
Hypereutectic Al–Si alloys and their composites attract much attention for heat dissipation and electronic packaging applications due to their low density, high wear resistance, low thermal expansion coefficient and excellent thermal conductivity [1,2]
The binder system consisted of 35 wt. % high density polyethylene (HDPE), 62 wt.% carnauba wax (CW), and 3 wt.% stearic acid (SA)
Both dissolution and diffusion proceeded with difficulty, and the solvent debinding process stabilized
Summary
Hypereutectic Al–Si alloys and their composites attract much attention for heat dissipation and electronic packaging applications due to their low density, high wear resistance, low thermal expansion coefficient and excellent thermal conductivity [1,2]. As electronic packaging strives continuously toward smaller size, higher integration and more complex geometries, conventional ingot metallurgy could not meet such requirements. Many efforts have been directed to the fabrication of hypereutectic. Al–Si alloys and their composites using different process technologies. Sumitomo Electric Industries developed an Al (60 wt.%) and Si (40 wt.%) composite for electronic packaging by traditional powder metallurgy technology [3]. Hogg et al [4] investigated the microstructure of a spray-formed Al–Si (30 wt.%) alloy used in electronic packaging applications. Zhang et al [5] produced a 70 vol.%
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