Abstract
Thermal analysis is critical in the conceptual design phase of miniaturized power electronic circuits. Concurrent thermal and packaging design along with electrical design can ensure shortened time-to-market. However, uncertainties in estimates of component loss distribution in the early design phase hamper analysis of whether a proposed design will meet thermal specifications. In this paper, a methodology based on design of experiments (DOE) is proposed to deal with such uncertainties. By combining this methodology with a thermal analysis tool, uncertainties in individual component loss estimates can be translated to predicted temperatures with a minimum number of computational runs. The designer can also use the sensitivity coefficients generated as a result of such analysis to judge the effect of efficiency improvement in individual components on the overall temperature field. An example of the thermal design of a power electronics circuit is provided, where this method has been used to study various design trade-offs and to significantly reduce the design cycle.
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