DDtM: Increasing Latent Defect Detection in Analog/Mixed-Signal ICs Using the Difference in Distance to Mean Value

Abstract

With quality and reliability requirements moving toward the ppb level, latent defects have become a major bottleneck. This article introduces a new metric, called difference in the distance to mean value (DDtM), that exploits the latent defect information present in measurements of an integrated circuit (IC) carried out under more than one operating condition. The use of this metric improves the latent defect coverage provided by post-processing (PP) techniques at no additional cost. The DDtM tracks, for each measured variable, shift in the distance from the IC’s measured value to the population mean value when the conditions applied to the IC change. To demonstrate the effectiveness of the DDtM metric, two circuits that are part of an industrial mixed-signal IC are used as case studies. The results show that the use of the DDtM metric improves latent defect coverage regardless of the PP technique used, providing up to a 60% improvement in coverage compared to the results obtained using the same measurement data but without DDtM.