Abstract
In this work, the device characteristics of GaN-based high-electron-mobility transistors (HEMTs) were systematically investigated by the direct current (DC) and low-frequency noise (LFN) measurements within the temperature ranging from 300 K to 4.2 K. The temperature-dependent behavior of the on- and off-state electrical properties was statistically analyzed, highlighting an overall improved device performance under cryogenic temperatures. In addition, the LFN of the device exhibited an evident behavior of 1/f noise from 10 Hz to 10 kHz in the measured temperature range and can be well described by the carrier number fluctuations with correlated mobility fluctuations (CNF/CMF) model down to 4.2 K. Based on this model, we further extracted and discussed the defect-related behavior in the devices under low-temperature environments. These experimental results provide insights into the device characteristics of GaN-based HEMTs under cryogenic environments, motivating further studies into the GaN-based cryo-devices and systems.
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