Damping properties of Sn58Bi and Sn3.0Ag0.5Cu solders with different thicknesses and preparation directions

Abstract

PurposeThis study aims to experimentally assess the effect of thickness and preparation direction on the damping properties of Sn58Bi and Sn3.0Ag0.5Cu solders.Design/methodology/approachSn58Bi and Sn3.0Ag0.5Cu solder strips with different thicknesses were prepared from the bulk in longitudinal and horizontal directions, and the ratio of loss modulus and storage modulus of the samples was measured by the dynamic mechanical analysis method as the index of damping properties.FindingsSn58Bi and Sn3.0Ag0.5Cu solders exhibited viscoelastic relaxation, and their damping properties decreased with decreasing thickness. The damping properties of both solders had no obvious difference in longitudinal and horizontal directions. Sn58Bi has a more obvious high-temperature damping background than Sn3.0Ag0.5Cu solder. In addition, compared with Sn58Bi solder, Sn3.0Ag0.5Cu solder had an obvious internal friction peak, which moved toward high temperature with increasing frequency. The activation energies of Sn58Bi solder with a thickness of 0.5 mm at the longitudinal and horizontal directions were 0.84 and 0.67 eV, respectively, which were 0.39 and 0.53 eV, respectively, for the Sn3.0Ag0.5Cu solder.Originality/valueThe damping properties of Sn58Bi and Sn3.0Ag0.5Cu solder decreased with decreasing thickness, while their damping properties changed insignificantly when they were prepared from different directions. The internal friction peak of Sn3.0Ag0.5Cu solder moved to higher temperatures with increasing frequency.