Abstract
Sn–37Pb solder and pure Sn metal exhibit a conspicuous high-temperature damping background (HTDB) in low-frequency internal friction Q - 1 ( T ) curves with activation energies, H, of HTDB being 0.43 and 0.98 eV, respectively. Sn–37Pb solder has a lamellar eutectic structure that can promote the diffusion-assisted climb of dislocations, resulting in lower H. Sn–3Ag–0.5Cu solder shows no HTDB in Q - 1 ( T ) curves since the formation of Cu6Sn5 and Ag3Sn intermetallics in the eutectic network band can impede dislocation motion.
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