Abstract
This paper presents a damage‐coupled viscoplastic constitutive model for characterizing thermomechanical fatigue (TMF) life of solder materials. The model takes into account the effects of microstructure, temperature and strain rate in the development of damage evolution equations. The TMF model is applied to characterize hysteresis loops of two solder materials, 63Sn‐37Pb and 95.5Sn‐3.9Ag‐0.6Cu, under both isothermal and thermomechanical cyclic loads. The TMF life prediction of 63Sn‐37Pb solder has been found to be a successful model, based on the load‐drop criterion, under fatigue loading.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
