Abstract
In many materials, including tin–lead eutectic solder, a substantial portion of their fatigue life is spent in accumulation of randomly distributed microcracks. An assembly of discrete interconnected elements (e.g. grains or phases) approximates the solid in this paper. Percolation theory is employed to derive critical microcrack density and to predict size effect. Self-similarity in microcrack nucleation leads to a simple power law for lifetime prediction. Its application to the fatigue of tin–lead eutectic solder shows a good agreement with experimental data.
Full Text 
Sign-in/Register to access full text options
Sign-in/Register to access full text options 
Published version (
Free)
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
