Abstract
Experiments were conducted to study the effect of the location of LSI chip on the heat transfer performance of a natural circulation, evaporative cooling system for LSI chip. A test silicon chip with dimensions of 10×10×0.5(mm)^3 was mounted on the bottom surface of a horizontal rectangular duct located at the bottom of the natural circulation loop in which FC-72 was filled. The space height of the duct s was set at 1,10 and 25mm. A smooth chip and a chip with square micro-pin-fins were tested. Experiments were conducted at the liquid subcooling ΔT_<sub> of 10,25 and 35K. Comparison of the results revealed that the highest performance was obtained by the micro-pin-finned chip with s=10mm.
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