D125 ヒートパイプの高性能化と高機能化(OS-7:電子機器冷却における熱流動現象(2))

Abstract

Two sizes of plate-type heat pipes were produced experimentally by diffusion bonding of two copper thin plates. Thermal performances of these plate-type heat pipes were examined by liquid cooling of condensation section. For large-scaled plate-type heat pipe which 3.8mm in thickness, 40mm in width, and 375mm in length, thermal resistance of 0.06K/W at maximum heat transport ratio of 250W was obtained in the bottom heat condition. Verification tests of cooling for CPU in server with these plate-type heat pipes were also carried out using real server, and CPU case temperatures were kept lower than 60℃ for both heat pipes.