Abstract
The reliability of printed circuit boards under dynamic loads is a key issue in the handheld electronic products industry. In order to predict the performance of the boards in their application lifetime, different tests were developed. The current industry-wide standard testing method is a board level drop test. In this test, the boards are dropped under defined conditions until a failure in the board is detected. The main failure driver is a flexural oscillation of the board due to the impact event. As this test method has a number of drawbacks, an alternative test method was evaluated in this study. A board level cyclic bend test was used and the results of both tests were compared. A very good correlation between the methods could be observed, supporting the suitability of the board level cyclic bend test for the determination of the drop test performance. The advantages of the alternative test method were shorter testing times, better adaptability and test simulations at lower computing time. In future analysis, test simulations will be used to generate Wöhler curves related to the local stresses.
Highlights
The reliability of printed circuit boards under dynamic loads is a key issue in the handheld electronic products industry
The performance of printed circuit boards (PCBs) under dynamic loads is of significant interest due to the increasing market for handheld electronic products
A standardized board level drop test (BLDT) JESD22B111 was defined under the Joint Electronic Device Engineering Council (JEDEC) [2]
Summary
The performance of printed circuit boards (PCBs) under dynamic loads is of significant interest due to the increasing market for handheld electronic products. Because of their size and application, handheld electronic products are especially prone to be dropped, i.e. exposed to an impact load during their useful service life. A standardized board level drop test (BLDT) JESD22B111 was defined under the Joint Electronic Device Engineering Council (JEDEC) [2]. In this test defined drops of the PCBs are repeated until failure is detected. A board level cyclic bend test (BLCBT), applying a repeated and well defined flexure, was used to reproduce the loading situation
Sign-in/Register to view highlights & summary Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
