Cyanate ester resins containing Si-O-C hyperbranched polysiloxane with favorable curing processability and toughness for electronic packaging

Abstract

High-performance electronic packaging materials with favorable processability are highly desirable to satisfy the booming of new generation communication technology. Herein, the bisphenol A cyanate ester (BADCy) resins containing Si-O-C hyperbranched polysiloxane were fabricated with facile curing process to achieve the application of electronic packaging. The fabricated BADCy resins exhibited not only significantly reduced curing temperature in favor of facile processability, but also dramatically enhanced toughness for prolonging the service life of packaging materials. The curing peak temperature was miraculously decreased by 93.5 °C. Meanwhile, the impact strength was significantly enhanced by 105.3%. Notably, the BADCy resins presented lower dielectric constant (ε of 2.59) and dielectric loss tangent values (tan δ of 0.0062) at 10 GHz. The results suggest that HSiEP possesses promising potential applications in the field of electronic packaging.