Abstract
AbstractAs the clock speed and chip power density continue to increase, heat management is becoming an ever‐increasing challenge for package designers. In addition, the demand for a narrow profile in consumer products and compact footprint may disqualify traditional heat dissipation materials as viable solutions. Diamond is a premier candidate for this application because of its unmatched thermal conductivity and low density. However, the outstanding issue is cost and availability. This paper discusses dc arc jet deposition technology and the stress issues that must be addressed to develop a reliable fabrication process. By adopting tight process control and matching the substrate's thermal properties to the film, a crack‐free 175‐mm‐diameter diamond wafer fabrication process has been developed with uniform properties and wafer yields that exceed 90% for thicknesses greater than 200 μm.
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