Abstract
For waste electrical and electronic equipment (WEEE), large quantities of waste printed circuit boards (PCBs) are released into environment. In light of their characteristics including complex structures, high metals content and potential hazards, waste PCBs are regarded as the most difficult parts of WEEE to be recycled. Therefore in recent ten years, the issue has attracted much attention from researchers and enterprises. This article reviews the latest processes of waste PCBs developed from laboratories to pilot engineering applications, and presents the most suitable available technology for waste PCBs, typically categorized as manually dismantling and automatic approaches in developing and developed countries, respectively. Towards achieving the better sustainability and recyclability for waste PCBs, nonmetal powder and precious metals should be developed for a deep recovery following mechanical treatment. Additionally, a significant shift is emerging from dismantling for recycling of printed wiring boards, to disassembling for remanufacturing of electronic components, which will indicate that a new paradigm of reclaiming waste PCBs is shaping.
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