Current pulse plating of nickel-iron alloys on rotating disk electrodes

Abstract

Nickel-iron alloys were electrodeposited using transient pulsed currents on rotating disk electrodes. It was found that the influence of mass transfer on the nickel and iron deposition rates is through the chemical equilibrium of the respective surface electroactive species of nickel and ferrous hydroxyl ions. The iron reduction rate increases with the introduction of boric acid, while the nickel deposition rate decreases at larger applied pulsed currents. Further additions of surfactants and complexing agents such as saccharin and ethylene diamine decrease both the nickel and iron deposition rates through a simple surface-blocking and solution-chelating process.